Trade Finance TechChallenge


This TechChallenge was a joint initiative of the BIS Innovation Hub (BISIH) and the Hong Kong Monetary Authority (HKMA). It was designed to showcase the potential for new innovative technologies to resolve problems in trade finance ("trade tech").

The 17 winners tackled challenges of connecting trade tech platforms, improving trade finance inclusion for small and medium-sized enterprises (SMEs) and developing trade tech infrastructure for emerging market economies (EMEs).

Problem statements

The winners were selected from a total of 103 technology solutions submitted by applicants from all over the world to the three problem statements. The winners showcased their submissions at the Hong Kong Fintech Week, which ran as a virtual event this year on 2-6 November 2020.