Template-Type: ReDIF-Paper 1.0
Author-Name: Giulio Cornelli
Author-X-Name-First: Giulio
Author-X-Name-Last: Cornelli
Author-Name: Jon Frost
Author-X-Name-First: Jon
Author-X-Name-Last: Frost
Author-Name: Leonardo Gambacorta
Author-X-Name-First: Leonardo
Author-X-Name-Last: Gambacorta
Author-Name: Raghavendra Rau
Author-X-Name-First: Raghavendra
Author-X-Name-Last: Rau
Author-Name: Robert Wardrop
Author-X-Name-First: Robert
Author-X-Name-Last: Wardrop
Author-Name: Tania Ziegler
Author-X-Name-First: Tania
Author-X-Name-Last: Ziegler
Title: Fintech and big tech credit: a new database
Abstract: Fintech and big tech platforms have expanded their lending around the world. We estimate that the flow of these new forms of credit reached USD 223 billion and USD 572 billion in 2019, respectively. China, the United States and the United Kingdom are the largest markets for fintech credit. Big tech credit is growing fast in China, Japan, Korea, Southeast Asia and some countries in Africa and Latin America. Cross-country panel regressions show that such lending is more developed in countries with higher GDP per capita (at a declining rate), where banking sector mark-ups are higher and where banking regulation is less stringent. Fintech credit is larger where there are fewer bank branches per capita. We also find that fintech and big tech credit are more developed where the ease of doing business is greater, and investor protection disclosure and the efficiency of the judicial system are more advanced, the bank creditto- deposit ratio is lower and where bond and equity markets are more developed. Overall, alternative credit seems to complement other forms of credit, rather than substitute for them.
Length: 35 pages
Creation-Date: 2020-09
File-URL: https://www.bis.org/publ/work887.pdf
File-Format: Application/pdf
File-Function: Full PDF document
File-URL: https://www.bis.org/publ/work887.htm
File-Format: text/html
Number: 887
Keywords: fintech, big tech, credit, data, technology, digital innovation
Classification-JEL: E51, G23, O31
Handle: RePEc:bis:biswps:887